
09/2007-Present Stanford University, M.S. in Mechanical Engineering
expected in 2009
09/2003-06/2007 UCLA, Henry Samueli
School of Engineering and Applied Science, B.S. in Mechanical Engineering with Summa Cum
Laude conferred in
June 2007
04/2002-07/2003
Work Experience
06/2006-08/2006
l Designed and simulated
circuits to demonstrate a plastic
characteristic of a configurable memory device by achieving simple pattern
recognition using neural network principles under
Prof.
01/2006-06/2006 Research Assistant, Prof.
l Constructed a pressure
control system for nano-imprinting lithography using LabVIEW
l Achieved
30nm wide 60nm pitch features
06/2005-09/2005 COMSOL
Inc., Technical Support Intern
l Technical
support of COMSOL Multiphysics including MATLAB
and Solidworks interface
l Development of COMSOL Multiphysics 3.1, Japanese International
Version
09/2004-08/2005 Research Assistant, Prof. Y. Suntaek
Ju, UCLA MAE
l Simulated contact thermal resistance of an oxide nanolaminate
on a silicon
substrate using FEMLAB (currently named as COMSOL Multiphysics) and MATLAB
Publications
Journal
Papers
Ju,
Y. S., Hung, M.-T., and Usui, T., “Nanoscale Heat Conduction
across Metal-Dielectric Interfaces”, ASME Journal of Heat Transfer, Vol. 128,
pp919-925, 2006.
Conference
Presentations
Ju, Y. S., Hung, M.-T., and Usui, T.,
“Nanoscale Heat Conduction across Metal-Dielectric Interfaces”, ASME Summer
Heat Transfer Conference,
l School of Engineering Fellowship, Stanford University
l Outstanding Bachelor of Science Award in Mechanical Engineering,
UCLA
l Dean’s Honor List: Fall
03, Spring/Fall 04, Winter/Spring 05, Winter/Spring/Fall 06, Spring 07
l Officer,
Tau Beta Pi, the National Engineering Honor Society
l Member, Golden Key, the International
Honor Society
Contact Info
Mailing Address:
Phone:310-825-1350
Fax:310-825-1350
Email: takane@stanford.edu